Optimisation of Reflow Profile of Surface Mount Assembly Using Taguchi Design of Experiments

assessment of the efficiency of s.p.g.c refineries using network dea

data envelopment analysis (dea) is a powerful tool for measuring relative efficiency of organizational units referred to as decision making units (dmus). in most cases dmus have network structures with internal linking activities. traditional dea models, however, consider dmus as black boxes with no regard to their linking activities and therefore do not provide decision makers with the reasons...

investigation of thermal comfort properties of woven sport fabric using blend of estabragh fibers

امروزه لباس در نظر ورزشکاران و کسانی که برای اوقات فراغت خود و یا برای رسیدن به اندامی متعادل، ورزش می کنند؛ بسیار با اهمیت است. احساس مطلوب از لباس در زمره خصوصیات راحتی پوشش می باشد. خصوصیات انتقال رطوبت لباس، در ارزیابی راحتی حسی و حرارتی منسوجات تولید شده از آن ها بسیار مهم است. هدف از این تحقیق، معرفی پارچه جدید است که متشکل از الیاف استبرق با خواص منحصر به فرد می باشد. استبرق لیف طبیعی تو...

Optimum parameters of nonlinear integrator using design of experiments based on Taguchi method

For many physical systems like vehicles, acceleration can be easily measured for the respective states. However, the outputs are usually affected by stochastic noise disturbance. The mentioned systems are often sensitive to noise and structural uncertainties. Furthermore, it is very difficult to estimate the multiple integrals of the signal, acceleration to velocity and velocity to position. In...

Optimisation of assembly scheduling in VCIM systems using genetic algorithm

Assembly plays an important role in any production system as it constitutes a significant portion of the lead time and cost of a product. Virtual computer-integrated manufacturing (VCIM) system is a modern production system being conceptually developed to extend the application of traditional computer-integrated manufacturing (CIM) system to global level. Assembly scheduling in VCIM systems is ...

Reflow Soldering Guidelines for Surface - Mount Devices